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    Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys

    New search for: Silva, Bismarck L.
    New search for: Xavier, Marcella G.C.
    New search for: Garcia, Amauri
    New search for: Spinelli, José E.

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    Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys

    New search for: Silva, Bismarck L.
    New search for: Xavier, Marcella G.C.
    New search for: Garcia, Amauri
    New search for: Spinelli, José E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys

    New search for: Silva, Bismarck L.
    New search for: Xavier, Marcella G.C.
    New search for: Garcia, Amauri
    New search for: Spinelli, José E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys

    Contributors:

    Silva, Bismarck L. (author) / Xavier, Marcella G.C. (author) / Garcia, Amauri (author) / Spinelli, José E. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 705 ; 325-334

    Publication date:

    2017-01-01

    Size:

    10 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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