Microstructure and tensile behavior of Sn-5Sb lead-free solder alloy containing Bi and Cu: Fid-Bau Portal

Microstructure and tensile behavior of Sn-5Sb lead-free solder alloy containing Bi and Cu

Esfandyarpour, M. J. / Mahmudi, R.

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Microstructure and tensile behavior of Sn-5Sb lead-free solder alloy containing Bi and Cu

Esfandyarpour, M. J. / Mahmudi, R.

Microstructure and tensile behavior of Sn-5Sb lead-free solder alloy containing Bi and Cu

Esfandyarpour, M. J. / Mahmudi, R.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Microstructure and tensile behavior of Sn-5Sb lead-free solder alloy containing Bi and Cu

Contributors:

Esfandyarpour, M. J. (author) / Mahmudi, R. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 530 ; 402-410

Publication date:

2011-01-01

Size:

9 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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