Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on diverse crystal planes: Fid-Bau Portal

Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on diverse crystal planes

Mu, D. / Huang, H. / McDonald, S. D. / Read, J. / Nogita, K.

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Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on diverse crystal planes

Mu, D. / Huang, H. / McDonald, S. D. / Read, J. / Nogita, K.

Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on diverse crystal planes

Mu, D. / Huang, H. / McDonald, S. D. / Read, J. / Nogita, K.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on diverse crystal planes

Contributors:

Mu, D. (author) / Huang, H. (author) / McDonald, S. D. (author) / Read, J. (author) / Nogita, K. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 566 ; 126-133

Publication date:

2013-01-01

Size:

8 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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