Adhesion Strength of Electroless Copper Plated Layer on Fluoropolymer Surface Modified by Medium Pressure Plasma: Fid-Bau Portal

Adhesion Strength of Electroless Copper Plated Layer on Fluoropolymer Surface Modified by Medium Pressure Plasma

Ooka, K. / Yamamoto, Y. / Hara, Y. / Zettsu, N. / Yamamura, K.

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Adhesion Strength of Electroless Copper Plated Layer on Fluoropolymer Surface Modified by Medium Pressure Plasma

Ooka, K. / Yamamoto, Y. / Hara, Y. / Zettsu, N. / Yamamura, K.

Adhesion Strength of Electroless Copper Plated Layer on Fluoropolymer Surface Modified by Medium Pressure Plasma

Ooka, K. / Yamamoto, Y. / Hara, Y. / Zettsu, N. / Yamamura, K.

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Check availability in my library

Order at Subito €

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Document information

Title:

Adhesion Strength of Electroless Copper Plated Layer on Fluoropolymer Surface Modified by Medium Pressure Plasma

Contributors:

Ooka, K. (author) / Yamamoto, Y. (author) / Hara, Y. (author) / Zettsu, N. (author) / Yamamura, K. (author)

Published in:

KEY ENGINEERING MATERIALS ; 523/524 ; 262-266

Publication date:

2012-01-01

Size:

5 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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