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    Aging Effect on Adhesion Strength between Electroless Copper and Polyimide Films

    New search for: Lee, H.-N.
    New search for: Han, Y.
    New search for: Lee, J.-h.
    New search for: Hur, J.-Y.
    New search for: Lee, H.K.

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    Aging Effect on Adhesion Strength between Electroless Copper and Polyimide Films

    New search for: Lee, H.-N.
    New search for: Han, Y.
    New search for: Lee, J.-h.
    New search for: Hur, J.-Y.
    New search for: Lee, H.K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Aging Effect on Adhesion Strength between Electroless Copper and Polyimide Films

    New search for: Lee, H.-N.
    New search for: Han, Y.
    New search for: Lee, J.-h.
    New search for: Hur, J.-Y.
    New search for: Lee, H.K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Aging Effect on Adhesion Strength between Electroless Copper and Polyimide Films

    Contributors:

    Lee, H.-N. (author) / Han, Y. (author) / Lee, J.-h. (author) / Hur, J.-Y. (author) / Lee, H.K. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 54 ; 1040-1044

    Publication date:

    2013-01-01

    Size:

    5 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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