Thermal Driving Method and Displacement Properties of a Thin-Film Polyimide Diaphragm for a MEMS Actuator: Fid-Bau Portal

Thermal Driving Method and Displacement Properties of a Thin-Film Polyimide Diaphragm for a MEMS Actuator

Mifuji, S. / Adachi, K. / Tsukioka, T. / Imai, S.

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Thermal Driving Method and Displacement Properties of a Thin-Film Polyimide Diaphragm for a MEMS Actuator

Mifuji, S. / Adachi, K. / Tsukioka, T. / Imai, S.

Thermal Driving Method and Displacement Properties of a Thin-Film Polyimide Diaphragm for a MEMS Actuator

Mifuji, S. / Adachi, K. / Tsukioka, T. / Imai, S.

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Check availability in my library

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Title:

Thermal Driving Method and Displacement Properties of a Thin-Film Polyimide Diaphragm for a MEMS Actuator

Contributors:

Mifuji, S. (author) / Adachi, K. (author) / Tsukioka, T. (author) / Imai, S. (author)

Published in:

KEY ENGINEERING MATERIALS ; 523/524 ; 563-568

Publication date:

2012-01-01

Size:

6 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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