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    Mechanical and electronic properties of Ag3Sn intermetallic compound in lead free solders using ab initio atomistic calculation

    New search for: Kumar, S.
    New search for: Jung, J.

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    Mechanical and electronic properties of Ag3Sn intermetallic compound in lead free solders using ab initio atomistic calculation

    New search for: Kumar, S.
    New search for: Jung, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Mechanical and electronic properties of Ag3Sn intermetallic compound in lead free solders using ab initio atomistic calculation

    New search for: Kumar, S.
    New search for: Jung, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
    Title:

    Mechanical and electronic properties of Ag3Sn intermetallic compound in lead free solders using ab initio atomistic calculation

    Contributors:

    Kumar, S. (author) / Jung, J. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING B ADVANCED FUNCTIONAL SOLID STATE MATERIALS ; 178 ; 10-21

    Publication date:

    2013-01-01

    Size:

    12 pages

    ISSN:

    0921-5107

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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