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    The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

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    New search for: Duh, J. G.

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    The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

    New search for: Tseng, C. F.
    New search for: Duh, J. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

    New search for: Tseng, C. F.
    New search for: Duh, J. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Document information
    Similar titles

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    Document information
    Title:

    The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

    Contributors:

    Tseng, C. F. (author) / Duh, J. G. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 48 ; 857-865

    Publication date:

    2013-01-01

    Size:

    9 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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