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    Correlation between microstructure evolution and mechanical strength in the Sn–3.0Ag–0.5Cu/ENEPIG solder joint

    New search for: Tseng, C. F.
    New search for: Duh, J. G.

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    Correlation between microstructure evolution and mechanical strength in the Sn–3.0Ag–0.5Cu/ENEPIG solder joint

    New search for: Tseng, C. F.
    New search for: Duh, J. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Correlation between microstructure evolution and mechanical strength in the Sn–3.0Ag–0.5Cu/ENEPIG solder joint

    New search for: Tseng, C. F.
    New search for: Duh, J. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Correlation between microstructure evolution and mechanical strength in the Sn–3.0Ag–0.5Cu/ENEPIG solder joint

    Contributors:

    Tseng, C. F. (author) / Duh, J. G. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 580 ; 169-174

    Publication date:

    2013-01-01

    Size:

    6 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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