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    Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron

    New search for: Qu, J. F.
    New search for: Xu, J.
    New search for: Hu, Q.
    New search for: Zhang, F. W.
    New search for: Zhang, S. M.

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    Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron

    New search for: Qu, J. F.
    New search for: Xu, J.
    New search for: Hu, Q.
    New search for: Zhang, F. W.
    New search for: Zhang, S. M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron

    New search for: Qu, J. F.
    New search for: Xu, J.
    New search for: Hu, Q.
    New search for: Zhang, F. W.
    New search for: Zhang, S. M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron

    Contributors:

    Qu, J. F. (author) / Xu, J. (author) / Hu, Q. (author) / Zhang, F. W. (author) / Zhang, S. M. (author)

    Published in:

    RARE METALS -BEIJING- ENGLISH EDITION ; 34 ; 783-788

    Publication date:

    2015-01-01

    Size:

    6 pages

    ISSN:

    1001-0521

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  669

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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