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    Adhesion improvement of electroless copper plating on phenolic resin matrix composite through a tin-free sensitization process

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    New search for: Bian, C.
    New search for: Jing, X.

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    Adhesion improvement of electroless copper plating on phenolic resin matrix composite through a tin-free sensitization process

    New search for: Wang, Y.
    New search for: Bian, C.
    New search for: Jing, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Adhesion improvement of electroless copper plating on phenolic resin matrix composite through a tin-free sensitization process

    New search for: Wang, Y.
    New search for: Bian, C.
    New search for: Jing, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Adhesion improvement of electroless copper plating on phenolic resin matrix composite through a tin-free sensitization process

    Contributors:

    Wang, Y. (author) / Bian, C. (author) / Jing, X. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 271 ; 303-310

    Publication date:

    2013-01-01

    Size:

    8 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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