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    Bondability of Copper Joints Formed Using a Mixed Paste of Ag~2O and CuO for Low-Temperature Sinter Bonding

    New search for: Ogura, T.
    New search for: Yagishita, T.
    New search for: Takata, S.
    New search for: Fujimoto, T.
    New search for: Hirose, A.

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    Bondability of Copper Joints Formed Using a Mixed Paste of Ag~2O and CuO for Low-Temperature Sinter Bonding

    New search for: Ogura, T.
    New search for: Yagishita, T.
    New search for: Takata, S.
    New search for: Fujimoto, T.
    New search for: Hirose, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Bondability of Copper Joints Formed Using a Mixed Paste of Ag~2O and CuO for Low-Temperature Sinter Bonding

    New search for: Ogura, T.
    New search for: Yagishita, T.
    New search for: Takata, S.
    New search for: Fujimoto, T.
    New search for: Hirose, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
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    Document information
    Title:

    Bondability of Copper Joints Formed Using a Mixed Paste of Ag~2O and CuO for Low-Temperature Sinter Bonding

    Contributors:

    Ogura, T. (author) / Yagishita, T. (author) / Takata, S. (author) / Fujimoto, T. (author) / Hirose, A. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 54 ; 860-865

    Publication date:

    2013-01-01

    Size:

    6 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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