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    Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads

    New search for: Tsao, L.C.
    New search for: Wu, R.W.
    New search for: Cheng, T.-H.
    New search for: Fan, K.-H.
    New search for: Chen, R.S.

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    Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads

    New search for: Tsao, L.C.
    New search for: Wu, R.W.
    New search for: Cheng, T.-H.
    New search for: Fan, K.-H.
    New search for: Chen, R.S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads

    New search for: Tsao, L.C.
    New search for: Wu, R.W.
    New search for: Cheng, T.-H.
    New search for: Fan, K.-H.
    New search for: Chen, R.S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads

    Contributors:

    Tsao, L.C. (author) / Wu, R.W. (author) / Cheng, T.-H. (author) / Fan, K.-H. (author) / Chen, R.S. (author)

    Published in:

    MATERIALS AND DESIGN -REIGATE- ; 50 ; 774-781

    Publication date:

    2013-01-01

    Size:

    8 pages

    ISSN:

    0261-3069

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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