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    Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder

    New search for: Chuang, C.L.
    New search for: Tsao, L.C.
    New search for: Lin, H.K.
    New search for: Feng, L.P.

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    Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder

    New search for: Chuang, C.L.
    New search for: Tsao, L.C.
    New search for: Lin, H.K.
    New search for: Feng, L.P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder

    New search for: Chuang, C.L.
    New search for: Tsao, L.C.
    New search for: Lin, H.K.
    New search for: Feng, L.P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder

    Contributors:

    Chuang, C.L. (author) / Tsao, L.C. (author) / Lin, H.K. (author) / Feng, L.P. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 558 ; 478-484

    Publication date:

    2012-01-01

    Size:

    7 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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