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Thermal fatigue behaviors of Sn–4Ag/Cu solder joints at low strain amplitude

Zhang, Q. K. / Zhang, Z. F.

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Thermal fatigue behaviors of Sn–4Ag/Cu solder joints at low strain amplitude

Zhang, Q. K. / Zhang, Z. F.

Thermal fatigue behaviors of Sn–4Ag/Cu solder joints at low strain amplitude

Zhang, Q. K. / Zhang, Z. F.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Thermal fatigue behaviors of Sn–4Ag/Cu solder joints at low strain amplitude

Contributors:

Zhang, Q. K. (author) / Zhang, Z. F. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 580 ; 374-384

Publication date:

2013-01-01

Size:

11 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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