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Analysis of Stress-Strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints
Analysis of Stress-Strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints
Analysis of Stress-Strain Hysteresis Loop and Prediction of Thermal Fatigue Life for Chip Size Package Solder Joints
Shohji, I. (author) / Kobayashi, T. (author) / Tohei, T. (author) / Ariffin, A.K. / Abdullah, S. / Ali, A. / Muchtar, A. / Ghazali, M.J. / Sajuri, Z.
2011-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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