A platform for research: civil engineering, architecture and urbanism
Electrochemical characterization of copper chemical mechanical planarization in KIO3 slurry
Electrochemical characterization of copper chemical mechanical planarization in KIO3 slurry
Electrochemical characterization of copper chemical mechanical planarization in KIO3 slurry
Du, T. (author) / Tamboli, D. (author) / Luo, Y. (author) / Desai, V. (author)
APPLIED SURFACE SCIENCE ; 229 ; 167-174
2004-01-01
8 pages
Article (Journal)
English
DDC:
621.35
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Chemical roles on Cu-slurry interface during copper chemical mechanical planarization
British Library Online Contents | 2014
|Chemical roles on Cu-slurry interface during copper chemical mechanical planarization
British Library Online Contents | 2014
|Chemical roles on Cu-slurry interface during copper chemical mechanical planarization
British Library Online Contents | 2014
|Chemical mechanical planarization of copper pH effect
British Library Online Contents | 2003
|Electropotential-stimulated wear of copper during chemical mechanical planarization
British Library Online Contents | 2007
|