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Effect of 2,2'-dipyridyl on the plating rate, microstructure and performance of copper-coated tungsten composite powders prepared using electroless plating
Effect of 2,2'-dipyridyl on the plating rate, microstructure and performance of copper-coated tungsten composite powders prepared using electroless plating
Effect of 2,2'-dipyridyl on the plating rate, microstructure and performance of copper-coated tungsten composite powders prepared using electroless plating
APPLIED SURFACE SCIENCE ; 301 ; 85-90
2014-01-01
6 pages
Article (Journal)
English
DDC:
621.35
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