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Effect of 2,2'-dipyridyl on the plating rate, microstructure and performance of copper-coated tungsten composite powders prepared using electroless plating
Effect of 2,2'-dipyridyl on the plating rate, microstructure and performance of copper-coated tungsten composite powders prepared using electroless plating
Effect of 2,2'-dipyridyl on the plating rate, microstructure and performance of copper-coated tungsten composite powders prepared using electroless plating
APPLIED SURFACE SCIENCE ; 301 ; 85-90
01.01.2014
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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