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    Effect of the Bonding Temperature on the Bonding Interface in the Press Bonding of Ti-17 Alloy

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    Effect of the Bonding Temperature on the Bonding Interface in the Press Bonding of Ti-17 Alloy

    New search for: Li, H.
    New search for: Li, M.Q.
    New search for: Liu, H.B.
    New search for: Yu, W.X.
    New search for: Tieu, A.K.
    New search for: Zhu, H.
    New search for: Zhu, Q.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of the Bonding Temperature on the Bonding Interface in the Press Bonding of Ti-17 Alloy

    New search for: Li, H.
    New search for: Li, M.Q.
    New search for: Liu, H.B.
    New search for: Yu, W.X.
    New search for: Tieu, A.K.
    New search for: Zhu, H.
    New search for: Zhu, Q.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Effect of the Bonding Temperature on the Bonding Interface in the Press Bonding of Ti-17 Alloy

    Contributors:

    Li, H. (author) / Li, M.Q. (author) / Liu, H.B. (author) / Yu, W.X. (author) / Tieu, A.K. / Zhu, H. / Zhu, Q.

    Published in:

    Advances in Materials and Processing Technologies XV Selected peer reviewed papers from the 15^t^h International Conference on Advances in Materials and Processing Technologies (AMPT 2012), September 23-26, 2012, Wollongong, Australia ; 732-740

    MATERIALS SCIENCE FORUM ; 773/774

    Publication date:

    2014-01-01

    Size:

    9 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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