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    Effect of deposit thickness during electroplating on Kirkendall voiding at Sn/Cu joints

    New search for: Yu, C.
    New search for: Yang, Y.
    New search for: Chen, J.
    New search for: Xu, J.
    New search for: Lu, H.

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    Effect of deposit thickness during electroplating on Kirkendall voiding at Sn/Cu joints

    New search for: Yu, C.
    New search for: Yang, Y.
    New search for: Chen, J.
    New search for: Xu, J.
    New search for: Lu, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of deposit thickness during electroplating on Kirkendall voiding at Sn/Cu joints

    New search for: Yu, C.
    New search for: Yang, Y.
    New search for: Chen, J.
    New search for: Xu, J.
    New search for: Lu, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of deposit thickness during electroplating on Kirkendall voiding at Sn/Cu joints

    Contributors:

    Yu, C. (author) / Yang, Y. (author) / Chen, J. (author) / Xu, J. (author) / Lu, H. (author)

    Published in:

    MATERIALS LETTERS ; 128 ; 9-11

    Publication date:

    2014-01-01

    Size:

    3 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105 / 530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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