Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints: Fid-Bau Portal

Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints

Kim, S.H. / Yu, J.

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Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints

Kim, S.H. / Yu, J.

Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints

Kim, S.H. / Yu, J.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints

Contributors:

Kim, S.H. (author) / Yu, J. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 25 ; 1854-1858

Publication date:

2010-01-01

Size:

5 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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