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    Kirkendall voids in the intermetallic layers of solder joints in MEMS

    New search for: Weinberg, K.
    New search for: Bohme, T.
    New search for: Muller, W. H.

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    Kirkendall voids in the intermetallic layers of solder joints in MEMS

    New search for: Weinberg, K.
    New search for: Bohme, T.
    New search for: Muller, W. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Kirkendall voids in the intermetallic layers of solder joints in MEMS

    New search for: Weinberg, K.
    New search for: Bohme, T.
    New search for: Muller, W. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Kirkendall voids in the intermetallic layers of solder joints in MEMS

    Contributors:

    Weinberg, K. (author) / Bohme, T. (author) / Muller, W. H. (author)

    Published in:

    COMPUTATIONAL MATERIALS SCIENCE ; 45 ; 827-831

    Publication date:

    2009-01-01

    Size:

    5 pages

    ISSN:

    0927-0256

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1 / 510

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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