Advanced TSV Filling Technology for 3-Dimensional Electronic Packaging: Fid-Bau Portal

Advanced TSV Filling Technology for 3-Dimensional Electronic Packaging

Lee, C.W. / Ko, Y.K. / Ko, Y.H. / Bang, J.H.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Advanced TSV Filling Technology for 3-Dimensional Electronic Packaging

Lee, C.W. / Ko, Y.K. / Ko, Y.H. / Bang, J.H.

Advanced TSV Filling Technology for 3-Dimensional Electronic Packaging

Lee, C.W. / Ko, Y.K. / Ko, Y.H. / Bang, J.H.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Advanced TSV Filling Technology for 3-Dimensional Electronic Packaging

Contributors:

Lee, C.W. (author) / Ko, Y.K. (author) / Ko, Y.H. (author) / Bang, J.H. (author)

Published in:

MATERIALS SCIENCE FORUM ; 783/786 ; 2758-2764

Publication date:

2014-01-01

Size:

7 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Similar titles

Advanced Electronic Packaging Materials

Zweben, C. | British Library Online Contents | 2005

Filling agent of packaging material, preparation method of filling agent, magnetic plastic packaging material and packaging device

YU ZHIGANG / ZHOU JIANJUN / YAN WENBO et al. | European Patent Office | 2024

Free access

Packaging technology - IPI offers advanced professional training

British Library Online Contents | 2009

Guest editorial: Electronic materials, packaging technologies, and radiation reliability in advanced memory packaging

DOAJ | 2023

Free access

Cu-SiC~p Composites as Advanced Electronic Packaging Materials

Azmi, K. / Derman, M.N. / Bakri, A.M.M.A. et al. | British Library Online Contents | 2014