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    Interfacially engineered liquid-phase-sintered Cu–In composite solders for thermal interface material applications

    New search for: Liu, J.
    New search for: Sahaym, U.
    New search for: Dutta, I.
    New search for: Raj, R.
    New search for: Renavikar, M.
    New search for: Sidhu, R. S.
    New search for: Mahajan, R.

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    Interfacially engineered liquid-phase-sintered Cu–In composite solders for thermal interface material applications

    New search for: Liu, J.
    New search for: Sahaym, U.
    New search for: Dutta, I.
    New search for: Raj, R.
    New search for: Renavikar, M.
    New search for: Sidhu, R. S.
    New search for: Mahajan, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Interfacially engineered liquid-phase-sintered Cu–In composite solders for thermal interface material applications

    New search for: Liu, J.
    New search for: Sahaym, U.
    New search for: Dutta, I.
    New search for: Raj, R.
    New search for: Renavikar, M.
    New search for: Sidhu, R. S.
    New search for: Mahajan, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Interfacially engineered liquid-phase-sintered Cu–In composite solders for thermal interface material applications

    Contributors:

    Liu, J. (author) / Sahaym, U. (author) / Dutta, I. (author) / Raj, R. (author) / Renavikar, M. (author) / Sidhu, R. S. (author) / Mahajan, R. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 49 ; 7844-7854

    Publication date:

    2014-01-01

    Size:

    11 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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