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Liquid phase sintered Cu–In composite solders for thermal interface material and interconnect applications
Liquid phase sintered Cu–In composite solders for thermal interface material and interconnect applications
Liquid phase sintered Cu–In composite solders for thermal interface material and interconnect applications
Liu, J. (author) / Kumar, P. (author) / Dutta, I. (author) / Raj, R. (author) / Sidhu, R. (author) / Renavikar, M. (author) / Mahajan, R. (author)
JOURNAL OF MATERIALS SCIENCE ; 46 ; 7012-7025
2011-01-01
14 pages
Article (Journal)
English
DDC:
620.11
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