Electronic Failure Analysis of Plate-Capacitors Bonding with Conductive Adhesives: Fid-Bau Portal

Electronic Failure Analysis of Plate-Capacitors Bonding with Conductive Adhesives

Song, Z.M. / Li, H.W. / Wang, B. / Cao, Q.T. / Hu, Y.L. / Zhang, Q.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Electronic Failure Analysis of Plate-Capacitors Bonding with Conductive Adhesives

Song, Z.M. / Li, H.W. / Wang, B. / Cao, Q.T. / Hu, Y.L. / Zhang, Q.

Electronic Failure Analysis of Plate-Capacitors Bonding with Conductive Adhesives

Song, Z.M. / Li, H.W. / Wang, B. / Cao, Q.T. / Hu, Y.L. / Zhang, Q.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Electronic Failure Analysis of Plate-Capacitors Bonding with Conductive Adhesives

Contributors:

Song, Z.M. (author) / Li, H.W. (author) / Wang, B. (author) / Cao, Q.T. (author) / Hu, Y.L. (author) / Zhang, Q. (author)

Published in:

MATERIALS SCIENCE FORUM ; 788 ; 569-572

Publication date:

2014-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Murray, C. T. / Rudman, R. L. / Sabade, M. B. et al. | British Library Online Contents | 2003

Epoxy Adhesives for Steel Plate Bonding Applications

Eisenhut, W. O. / American Concrete Institute | British Library Conference Proceedings | 1996

Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding

Kim, J.-M. / Song, Y. / Cho, M. et al. | British Library Online Contents | 2010

POLYCHLOROPRENE-BASED BONDING ADHESIVES

MEYER DARYL D / ATTIYA YOEL SIYAHU / KALWARA JOSEPH JOHN et al. | European Patent Office | 2017

Free access

KETTING - ADHESIVES AND BONDING MATERIALS

Online Contents | 1994