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    Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding

    New search for: Kim, J.-M.
    New search for: Song, Y.
    New search for: Cho, M.
    New search for: Lee, S.H.
    New search for: Shin, Y.-E.

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    Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding

    New search for: Kim, J.-M.
    New search for: Song, Y.
    New search for: Cho, M.
    New search for: Lee, S.H.
    New search for: Shin, Y.-E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding

    New search for: Kim, J.-M.
    New search for: Song, Y.
    New search for: Cho, M.
    New search for: Lee, S.H.
    New search for: Shin, Y.-E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding

    Contributors:

    Kim, J.-M. (author) / Song, Y. (author) / Cho, M. (author) / Lee, S.H. (author) / Shin, Y.-E. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 51 ; 1790-1795

    Publication date:

    2010-01-01

    Size:

    6 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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