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Fast phase transformation due to electromigration of 18μm microbumps in three-dimensional integrated-circuit integration
Fast phase transformation due to electromigration of 18μm microbumps in three-dimensional integrated-circuit integration
Fast phase transformation due to electromigration of 18μm microbumps in three-dimensional integrated-circuit integration
Chang, Y. W. (author) / Chen, C. (author) / Chang, T. C. (author) / Zhan, C. J. (author) / Juang, J. Y. (author) / Huang, A. T. (author)
MATERIALS LETTERS ; 137 ; 136-138
2014-01-01
3 pages
Article (Journal)
English
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