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    Three-dimensional model for electromigration induced evolution of flip chip solder joints

    New search for: Kim, D.

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    Three-dimensional model for electromigration induced evolution of flip chip solder joints

    New search for: Kim, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Three-dimensional model for electromigration induced evolution of flip chip solder joints

    New search for: Kim, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Title:

    Three-dimensional model for electromigration induced evolution of flip chip solder joints

    Contributors:

    Kim, D. (author)

    Published in:

    JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY ; 23 ; 504-511

    Publication date:

    2009-01-01

    Size:

    8 pages

    ISSN:

    1738-494X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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