In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction: Fid-Bau Portal

In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction

Huang, M. L. / Yang, F. / Zhao, N. / Zhang, Z. J.

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In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction

Huang, M. L. / Yang, F. / Zhao, N. / Zhang, Z. J.

In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction

Huang, M. L. / Yang, F. / Zhao, N. / Zhang, Z. J.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction

Contributors:

Huang, M. L. (author) / Yang, F. (author) / Zhao, N. (author) / Zhang, Z. J. (author)

Published in:

MATERIALS LETTERS ; 139 ; 42-45

Publication date:

2015-01-01

Size:

4 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105 / 530

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