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Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn–5.0wt% Sb–0.5wt% Cu lead-free solder alloy
Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn–5.0wt% Sb–0.5wt% Cu lead-free solder alloy
Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn–5.0wt% Sb–0.5wt% Cu lead-free solder alloy
Fouda, A. N. (author) / Eid, E. A. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 632 ; 82-87
2015-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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