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Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron
Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron
Modification of Sn–1.0Ag–0.5Cu solder using nickel and boron
Qu, J. F. (Autor:in) / Xu, J. (Autor:in) / Hu, Q. (Autor:in) / Zhang, F. W. (Autor:in) / Zhang, S. M. (Autor:in)
RARE METALS -BEIJING- ENGLISH EDITION ; 34 ; 783-788
01.01.2015
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
669
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