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Wetting process of copper filling in through silicon vias

Zhang, J. / Luo, W. / Li, Y. / Gao, L. / Li, M.

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Wetting process of copper filling in through silicon vias

Zhang, J. / Luo, W. / Li, Y. / Gao, L. / Li, M.

Wetting process of copper filling in through silicon vias

Zhang, J. / Luo, W. / Li, Y. / Gao, L. / Li, M.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Wetting process of copper filling in through silicon vias

Contributors:

Zhang, J. (author) / Luo, W. (author) / Li, Y. (author) / Gao, L. (author) / Li, M. (author)

Published in:

APPLIED SURFACE SCIENCE ; 359 ; 736-741

Publication date:

2015-01-01

Size:

6 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

Zhang, Junhong / Luo, Wei / Li, Yi et al. | British Library Online Contents | 2015

Wetting process of copper filling in through silicon vias

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Structural characterization of through silicon vias

Bender, H. / Drijbooms, C. / Marcke, P. et al. | British Library Online Contents | 2012

Wetting of silicon carbide by copper alloys

Martinez, V. / Ordonez, S. / Castro, F. et al. | British Library Online Contents | 2003

Thru-Silicon Vias for 3D WLP

Savastiouk, S. / Siniaguine, O. / Korczynski, E. | British Library Online Contents | 2000