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Structural characterization of through silicon vias

Bender, H. / Drijbooms, C. / Marcke, P. / Geypen, J. / Philipsen, H. G. / Radisic, A.

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Structural characterization of through silicon vias

Bender, H. / Drijbooms, C. / Marcke, P. / Geypen, J. / Philipsen, H. G. / Radisic, A.

Structural characterization of through silicon vias

Bender, H. / Drijbooms, C. / Marcke, P. / Geypen, J. / Philipsen, H. G. / Radisic, A.

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Order at Subito €

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Document information

Title:

Structural characterization of through silicon vias

Contributors:

Bender, H. (author) / Drijbooms, C. (author) / Marcke, P. (author) / Geypen, J. (author) / Philipsen, H. G. (author) / Radisic, A. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 47 ; 6497-6504

Publication date:

2012-01-01

Size:

8 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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