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Thru-Silicon Vias for 3D WLP

Savastiouk, S. / Siniaguine, O. / Korczynski, E.

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Thru-Silicon Vias for 3D WLP

Savastiouk, S. / Siniaguine, O. / Korczynski, E.

Thru-Silicon Vias for 3D WLP

Savastiouk, S. / Siniaguine, O. / Korczynski, E.

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Access via TIB

Check availability in my library

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Document information

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Document information

Title:

Thru-Silicon Vias for 3D WLP

Contributors:

Savastiouk, S. (author) / Siniaguine, O. (author) / Korczynski, E. (author)

Published in:

ADVANCING MICROELECTRONICS ; 27 ; 18-19

Publication date:

2000-01-01

Size:

2 pages

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.381

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