Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications: Fid-Bau Portal

Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

Mallik, S. / Ekere, N. N. / Durairaj, R. / Marks, A. E. / Seman, A.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

Mallik, S. / Ekere, N. N. / Durairaj, R. / Marks, A. E. / Seman, A.

Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

Mallik, S. / Ekere, N. N. / Durairaj, R. / Marks, A. E. / Seman, A.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications

Contributors:

Mallik, S. (author) / Ekere, N. N. (author) / Durairaj, R. (author) / Marks, A. E. (author) / Seman, A. (author)

Published in:

MATERIALS AND DESIGN -REIGATE- ; 30 ; 4502-4506

Publication date:

2009-01-01

Size:

5 pages

ISSN:

0264-1275

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.0042

Mallik, S. / Ekere, N.N. / Durairaj, R. et al. | Elsevier | 2009

Recrystallization behaviour of SnAgCu solder joints

Sundelin, J. J. / Nurmi, S. T. / Lepisto, T. K. | British Library Online Contents | 2008

Mechanical and microstructural properties of SnAgCu solder joints

Sundelin, J. J. / Nurmi, S. T. / Lepisto, T. K. et al. | British Library Online Contents | 2006

The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes

Durairaj, R. / Man, L. W. / Ekere, N. N. et al. | British Library Online Contents | 2010

Formation of Ag3Sn plates in SnAgCu solder bumps

Gong, J. / Liu, C. / Conway, P. P. et al. | British Library Online Contents | 2010