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Development of a Real-time Measurement Device for Monitoring the Internal Stress During Electroplating

Hong, J. G. / Lee, C. Y.

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Development of a Real-time Measurement Device for Monitoring the Internal Stress During Electroplating

Hong, J. G. / Lee, C. Y.

Development of a Real-time Measurement Device for Monitoring the Internal Stress During Electroplating

Hong, J. G. / Lee, C. Y.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Development of a Real-time Measurement Device for Monitoring the Internal Stress During Electroplating

Contributors:

Hong, J. G. (author) / Lee, C. Y. (author)

Published in:

EXPERIMENTAL TECHNIQUES ; 41 ; 51-57

Publication date:

2017-01-01

Size:

7 pages

ISSN:

0732-8818

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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