Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep

    New search for: Hasnine, M.
    New search for: Suhling, J. C.
    New search for: Prorok, B. C.
    New search for: Bozack, M. J.
    New search for: Lall, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep

    New search for: Hasnine, M.
    New search for: Suhling, J. C.
    New search for: Prorok, B. C.
    New search for: Bozack, M. J.
    New search for: Lall, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep

    New search for: Hasnine, M.
    New search for: Suhling, J. C.
    New search for: Prorok, B. C.
    New search for: Bozack, M. J.
    New search for: Lall, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep

    Contributors:

    Hasnine, M. (author) / Suhling, J. C. (author) / Prorok, B. C. (author) / Bozack, M. J. (author) / Lall, P. (author)

    Published in:

    EXPERIMENTAL MECHANICS ; 57 ; 603-614

    Publication date:

    2017-01-01

    Size:

    12 pages

    ISSN:

    0014-4851

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Thermal Fatigue and Creep Fracture Behaviors of a Nanocomposite Solder in Microelectronic/Optoelectronic Packaging

    Zhang, X. P. / Lim, C. S. H. / Mai, Y. W. et al. | British Library Online Contents | 2006

    Anomalous Creep in Sn-Rich Solder Joints

    Song, H. G. / Morris, J. W. / Hua, F. | British Library Online Contents | 2002

    Nano-Mechanical Creep Properties of Nanoclay/Epoxy Composite by Nanoindentation

    Lam, C. K. / Lau, K. T. / Zhou, L. M. | British Library Online Contents | 2007

    Creep Behavior of Shale: Nanoindentation vs. Triaxial Creep Tests

    Liu, Kouqi / Rassouli, Fatemeh S. / Liu, Bo et al. | Online Contents | 2020

    Size effects of nanoindentation creep

    Li, H. / Ngan, A. H. W. | British Library Online Contents | 2004

    Back to top