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    Thermal Fatigue and Creep Fracture Behaviors of a Nanocomposite Solder in Microelectronic/Optoelectronic Packaging

    New search for: Zhang, X. P.
    New search for: Lim, C. S. H.
    New search for: Mai, Y. W.
    New search for: Shi, Y. W.
    New search for: Liu, H.-Y.
    New search for: Hu, X.
    New search for: Hoffman, M.

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    Thermal Fatigue and Creep Fracture Behaviors of a Nanocomposite Solder in Microelectronic/Optoelectronic Packaging

    New search for: Zhang, X. P.
    New search for: Lim, C. S. H.
    New search for: Mai, Y. W.
    New search for: Shi, Y. W.
    New search for: Liu, H.-Y.
    New search for: Hu, X.
    New search for: Hoffman, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Thermal Fatigue and Creep Fracture Behaviors of a Nanocomposite Solder in Microelectronic/Optoelectronic Packaging

    New search for: Zhang, X. P.
    New search for: Lim, C. S. H.
    New search for: Mai, Y. W.
    New search for: Shi, Y. W.
    New search for: Liu, H.-Y.
    New search for: Hu, X.
    New search for: Hoffman, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Thermal Fatigue and Creep Fracture Behaviors of a Nanocomposite Solder in Microelectronic/Optoelectronic Packaging

    Contributors:

    Zhang, X. P. (author) / Lim, C. S. H. (author) / Mai, Y. W. (author) / Shi, Y. W. (author) / Liu, H.-Y. / Hu, X. / Hoffman, M.

    Published in:

    Fracture of Materials: Moving Forwards ; 237-242

    KEY ENGINEERING MATERIALS ; 312

    Publication date:

    2006-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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