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    Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics

    New search for: Wu, J.
    New search for: Lee, C. C.

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    Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics

    New search for: Wu, J.
    New search for: Lee, C. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics

    New search for: Wu, J.
    New search for: Lee, C. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics

    Contributors:

    Wu, J. (author) / Lee, C. C. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 53 ; 2618-2630

    Publication date:

    2018-01-01

    Size:

    13 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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