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Solid-Liquid Interdiffusion Bonding of Copper Using Ag-Sn Layered Films

Fukumoto, S. / Miyake, K. / Tatara, S. / Matsushima, M. / Fujimoto, K.

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Solid-Liquid Interdiffusion Bonding of Copper Using Ag-Sn Layered Films

Fukumoto, S. / Miyake, K. / Tatara, S. / Matsushima, M. / Fujimoto, K.

Solid-Liquid Interdiffusion Bonding of Copper Using Ag-Sn Layered Films

Fukumoto, S. / Miyake, K. / Tatara, S. / Matsushima, M. / Fujimoto, K.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Solid-Liquid Interdiffusion Bonding of Copper Using Ag-Sn Layered Films

Contributors:

Fukumoto, S. (author) / Miyake, K. (author) / Tatara, S. (author) / Matsushima, M. (author) / Fujimoto, K. (author)

Published in:

Materials transactions ; 56 ; 1019-1024

Publication date:

2015-01-01

Size:

6 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105

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