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    Effect of Zinc Addition on Void Formation in Solid-Liquid Interdiffusion Bonding of Copper

    New search for: Fukumoto, S.
    New search for: Miyazaki, T.
    New search for: Matsushima, M.
    New search for: Fujimoto, K.

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    Effect of Zinc Addition on Void Formation in Solid-Liquid Interdiffusion Bonding of Copper

    New search for: Fukumoto, S.
    New search for: Miyazaki, T.
    New search for: Matsushima, M.
    New search for: Fujimoto, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Zinc Addition on Void Formation in Solid-Liquid Interdiffusion Bonding of Copper

    New search for: Fukumoto, S.
    New search for: Miyazaki, T.
    New search for: Matsushima, M.
    New search for: Fujimoto, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Effect of Zinc Addition on Void Formation in Solid-Liquid Interdiffusion Bonding of Copper

    Contributors:

    Fukumoto, S. (author) / Miyazaki, T. (author) / Matsushima, M. (author) / Fujimoto, K. (author)

    Published in:

    Materials transactions ; 57 ; 846-852

    Publication date:

    2016-01-01

    Size:

    7 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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