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    Board Level Drop Reliability of Epoxy-Containing Sn-58 mass% Bi Solder Joints with Various Surface Finishes

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    New search for: Yoon, Jeong-Won
    New search for: Jung, Seung-Boo

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    Board Level Drop Reliability of Epoxy-Containing Sn-58 mass% Bi Solder Joints with Various Surface Finishes

    New search for: Lee, Sang-Min
    New search for: Yoon, Jeong-Won
    New search for: Jung, Seung-Boo

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Board Level Drop Reliability of Epoxy-Containing Sn-58 mass% Bi Solder Joints with Various Surface Finishes

    New search for: Lee, Sang-Min
    New search for: Yoon, Jeong-Won
    New search for: Jung, Seung-Boo

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    Board Level Drop Reliability of Epoxy-Containing Sn-58 mass% Bi Solder Joints with Various Surface Finishes

    Contributors:

    Lee, Sang-Min (author) / Yoon, Jeong-Won (author) / Jung, Seung-Boo (author)

    Published in:

    Materials transactions ; 57 ; 466-471

    Publication date:

    2016-01-01

    Size:

    6 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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