Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Board Level Drop Reliability of Epoxy-Containing Sn-58 mass% Bi Solder Joints with Various Surface Finishes
Board Level Drop Reliability of Epoxy-Containing Sn-58 mass% Bi Solder Joints with Various Surface Finishes
Board Level Drop Reliability of Epoxy-Containing Sn-58 mass% Bi Solder Joints with Various Surface Finishes
Lee, Sang-Min (Autor:in) / Yoon, Jeong-Won (Autor:in) / Jung, Seung-Boo (Autor:in)
Materials transactions ; 57 ; 466-471
01.01.2016
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1105
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