A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints
Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints
Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints
Yu, A-Mi (author) / Jang, Jae-Won (author) / Lee, Jong-Hyun (author) / Kim, Jun-Ki (author) / Kim, Mok-Soon (author)
2014-01-01
11 pages
Article (Journal)
English
DDC:
620.112
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