Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Wetting Characteristics of Sn-0.7Cu Lead-Free Solder Alloy on Copper Substrates

    New search for: Satyanarayan
    New search for: Prabhu, K.N.
    New search for: Murty, S.V.S.N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Wetting Characteristics of Sn-0.7Cu Lead-Free Solder Alloy on Copper Substrates

    New search for: Satyanarayan
    New search for: Prabhu, K.N.
    New search for: Murty, S.V.S.N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Wetting Characteristics of Sn-0.7Cu Lead-Free Solder Alloy on Copper Substrates

    New search for: Satyanarayan
    New search for: Prabhu, K.N.
    New search for: Murty, S.V.S.N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Wetting Characteristics of Sn-0.7Cu Lead-Free Solder Alloy on Copper Substrates

    Contributors:

    Satyanarayan (author) / Prabhu, K.N. (author) / Murty, S.V.S.N.

    Published in:

    Advances in Metallic Materials and Manufacturing Processes for Strategic Sectors ; 569-574

    MATERIALS SCIENCE FORUM ; 710

    Publication date:

    2012-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Low cycle fatigue study of lead free 99.3Sn-0.7Cu solder alloy

    Pang, J. H. / Xiong, B. S. / Low, T. H. | British Library Online Contents | 2004

    Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints

    Zhang, K.K. / Wang, Y.L. / Fan, Y.L. et al. | British Library Online Contents | 2010

    Mechanical properties of Sn–0.7Cu/Si3N4 lead-free composite solder

    Mohd Salleh, M. A. / Bakri, A. M. / Zan@Hazizi, M. H. et al. | British Library Online Contents | 2012

    Wetting of microcrystalline and nanocrystalline Ni substrates by molten Sn-3.5Ag-0.7Cu alloy

    Yang, J. / Shen, P. / Yin, Z. et al. | British Library Online Contents | 2010

    Effects of Phosphorus on Microstructure and Fluidity of Sn-0.7Cu-0.05Ni Lead-Free Solder

    Nogita, K. / Gourlay, C.M. / Read, J. et al. | British Library Online Contents | 2008

    Back to top