Effect of TiO~2 on the Formation of Primary and Interfacial Cu~6Sn~5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni Solder Paste during Soldering: Fid-Bau Portal

Effect of TiO~2 on the Formation of Primary and Interfacial Cu~6Sn~5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni Solder Paste during Soldering

Salleh, M. A. A. Mohd / Said, R. M. / Saud, N. / Yasuda, H. / McDonald, S. D. / Nogita, K.

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Effect of TiO~2 on the Formation of Primary and Interfacial Cu~6Sn~5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni Solder Paste during Soldering

Salleh, M. A. A. Mohd / Said, R. M. / Saud, N. / Yasuda, H. / McDonald, S. D. / Nogita, K.

Effect of TiO~2 on the Formation of Primary and Interfacial Cu~6Sn~5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni Solder Paste during Soldering

Salleh, M. A. A. Mohd / Said, R. M. / Saud, N. / Yasuda, H. / McDonald, S. D. / Nogita, K.

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Title:

Effect of TiO~2 on the Formation of Primary and Interfacial Cu~6Sn~5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni Solder Paste during Soldering

Contributors:

Salleh, M. A. A. Mohd (author) / Said, R. M. (author) / Saud, N. (author) / Yasuda, H. (author) / McDonald, S. D. (author) / Nogita, K. (author)

Published in:

Key engineering materials ; 700 ; 161-172

Publication date:

2016-01-01

Size:

12 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105

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