Microcreep of rapidly solidified Sn-0.7wt.% Cu-In solder alloys: Fid-Bau Portal

Microcreep of rapidly solidified Sn-0.7wt.% Cu-In solder alloys

Kamal, M. / El-Ashram, T.

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Microcreep of rapidly solidified Sn-0.7wt.% Cu-In solder alloys

Kamal, M. / El-Ashram, T.

Microcreep of rapidly solidified Sn-0.7wt.% Cu-In solder alloys

Kamal, M. / El-Ashram, T.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Microcreep of rapidly solidified Sn-0.7wt.% Cu-In solder alloys

Contributors:

Kamal, M. (author) / El-Ashram, T. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 456 ; 1-4

Publication date:

2007-01-01

Size:

4 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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