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    Evaluation of solder/substrate thermal conductance and wetting angle of Sn–0.7wt%Cu–(0–0.1wt%Ni) solder alloys

    New search for: Silva, B. L.
    New search for: Cheung, N.
    New search for: Garcia, A.
    New search for: Spinelli, J. E.

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    Evaluation of solder/substrate thermal conductance and wetting angle of Sn–0.7wt%Cu–(0–0.1wt%Ni) solder alloys

    New search for: Silva, B. L.
    New search for: Cheung, N.
    New search for: Garcia, A.
    New search for: Spinelli, J. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Evaluation of solder/substrate thermal conductance and wetting angle of Sn–0.7wt%Cu–(0–0.1wt%Ni) solder alloys

    New search for: Silva, B. L.
    New search for: Cheung, N.
    New search for: Garcia, A.
    New search for: Spinelli, J. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Evaluation of solder/substrate thermal conductance and wetting angle of Sn–0.7wt%Cu–(0–0.1wt%Ni) solder alloys

    Contributors:

    Silva, B. L. (author) / Cheung, N. (author) / Garcia, A. (author) / Spinelli, J. E. (author)

    Published in:

    MATERIALS LETTERS ; 142 ; 163-167

    Publication date:

    2015-01-01

    Size:

    5 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105 / 530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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